This inventor holds 2 USPTO granted patents. Top assignee: The Hong Kong Polytechnic University. Active years: 2024-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024-2026
Title: Jianguo Dai: Innovator in Radiative Cooling Technologies
Introduction
Jianguo Dai is a prominent inventor based in Hong Kong, China. He has made significant contributions to the field of materials science, particularly in the area of radiative cooling technologies. His innovative work has led to the development of a unique patent that showcases his expertise and creativity.
Latest Patents
Jianguo Dai holds a patent for a "Coating with smart sub-ambient radiative cooling." This invention includes a smart sub-ambient radiative cooling composition that features TiO particles, inorganic particles selected from a group consisting of SiO, CaCO, SiC, ZnO, AlO, ZnO, and mixtures thereof. Additionally, it incorporates fluorescent pigment particles and a polymer useful for sub-ambient radiative cooling, along with methods of preparation and use thereof. This patent highlights his commitment to advancing sustainable cooling technologies.
Career Highlights
Jianguo Dai is affiliated with The Hong Kong Polytechnic University, where he contributes to research and innovation in materials science. His academic background and research endeavors have positioned him as a leading figure in his field. His work not only enhances the understanding of radiative cooling but also paves the way for practical applications in energy efficiency.
Collaborations
Throughout his career, Jianguo Dai has collaborated with notable colleagues, including Xiao Xue and Dangyuan Lei. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the advancement of innovative technologies.
Conclusion
Jianguo Dai's contributions to the field of radiative cooling exemplify the impact of innovative thinking in addressing modern challenges. His patent and ongoing research at The Hong Kong Polytechnic University reflect his dedication to creating sustainable solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
