Shanghai, China

Jiangping Chen

This inventor holds 1 USPTO granted patent. Top assignee: Shanghai Jiao Tong University. Active years: 2026.


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jiangping Chen: Innovator in Heat Sink Technology

Introduction

Jiangping Chen is a notable inventor based in Shanghai, China. He has made significant contributions to the field of thermal management through his innovative designs. His work focuses on enhancing the efficiency of heat sinks, which are crucial components in various electronic devices.

Latest Patents

Jiangping Chen holds a patent for a "Three-channel heat sink based on tri-continuous mesoporous silica structure and preparation method for three-channel heat sink." This invention features a unique design that includes multiple three-channel porous units stacked on one another. Each unit comprises three channels that do not communicate with one another, ensuring efficient thermal management. The design incorporates five flow paths arranged in two layers, creating a parallelogram pattern that optimizes the flow of cooling mediums.

Career Highlights

Jiangping Chen is affiliated with Shanghai Jiao Tong University, where he continues to advance research in thermal management technologies. His academic background and innovative spirit have positioned him as a key figure in his field. With a focus on practical applications, his work has the potential to impact various industries reliant on effective heat dissipation.

Collaborations

Jiangping Chen collaborates with talented colleagues, including Haozhang Zhong and Jiaxuan Wang. Their combined expertise fosters a dynamic research environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Jiangping Chen's contributions to heat sink technology exemplify the importance of innovation in engineering. His patented designs not only enhance thermal efficiency but also pave the way for future advancements in electronic cooling solutions.

Profile summary based on public USPTO records.
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