Company Filing History:

10 out of 15

Lambda Technologies, Inc.

patents

4 out of 1,415

Michigan State University

patents

2 out of 136

Lockheed Martin Energy Research Corporation

where one patent can have more than one assignee

Years Active: 1995-2002

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15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6497786 - Methods and apparatus for bonding deformable materials having low deformation temperatures (2002-12-24),

2. 6312548 - Conductive insert for bonding components with microwave energy (2001-11-06),

3. 6103812 - Microwave curable adhesive (2000-08-15),

4. 5879756 - Curing polymer layers on semiconductor substrates using variable (1999-03-09),

5. 5844217 - Appratus for liquid thermosetting resin molding using radiofrequency (1998-12-01),

6. 5844216 - System and apparatus for reducing arcing and localized heating during (1998-12-01),

7. 5804801 - Adhesive bonding using variable frequency microwave energy (1998-09-08),

8. 5798395 - Adhesive bonding using variable frequency microwave energy (1998-08-25),

9. 5770143 - Method for liquid thermosetting resin molding using radiofrequency wave (1998-06-23),

10. 5750968 - System and apparatus for reducing arcing and localized heating during (1998-05-12),

11. 5738915 - Curing polymer layers on semiconductor substrates using variable (1998-04-14),

12. 5648038 - Systems and methods for monitoring material properties using microwave (1997-07-15),

13. 5644837 - Process for assembling electronics using microwave irradiation (1997-07-08),

14. 5470423 - Microwave pultrusion apparatus and method of use (1995-11-28),

15. 5406056 - Electromagnetic curing apparatus and method of use (1995-04-11),

Title: Jianghua Wei: Innovator in Bonding Technologies

Introduction

Jianghua Wei is a prominent inventor based in Raleigh, NC (US), known for his significant contributions to bonding technologies. With a total of 15 patents to his name, he has developed innovative methods and apparatus that enhance the bonding of deformable materials.

Latest Patents

Wei's latest patents include groundbreaking technologies such as "Methods and apparatus for bonding deformable materials having low deformation temperatures." This invention discloses systems, methods, and apparatus for bonding a plurality of substrates using a solventless, curable adhesive. The technology allows for the assembly of workpieces from multiple substrates while applying pressure and irradiating them with variable frequency microwave energy. This process ensures that the adhesive is heated without exceeding the deformation temperatures of the substrates. Another notable patent is "Conductive insert for bonding components with microwave energy." This invention facilitates the bonding of components through a conductive pattern that generates heat when exposed to microwave or RF energy. The conductive pattern can be used with or without adhesive resin, allowing for versatile applications in bonding technologies.

Career Highlights

Throughout his career, Jianghua Wei has worked with notable organizations such as Lambda Technologies, Inc. and Michigan State University. His experience in these institutions has contributed to his expertise in developing advanced bonding solutions.

Collaborations

Wei has collaborated with talented individuals in his field, including Zakaryae Fathi and Richard S Garard. These collaborations have further enriched his work and led to innovative advancements in bonding technologies.

Conclusion

Jianghua Wei's contributions to the field of bonding technologies are significant and impactful. His innovative patents and collaborations highlight his dedication to advancing the industry. His work continues to influence the development of new bonding methods and applications.

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