Guangdong, China

Jiang Ma

This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen University. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiang Ma. Retrieved from https://idiyas.com/inventor/jiang-ma-6mjqti67

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Jiang Ma - Innovator in Die Molding Technology

Introduction

Jiang Ma is a notable inventor based in Guangdong, China. He has made significant contributions to the field of amorphous alloy molding apparatuses. His innovative work has led to the development of a unique die molding apparatus that enhances the efficiency of the molding process.

Latest Patents

Jiang Ma holds 1 patent for his invention titled "Die Molding Apparatus." This patent relates to a die molding apparatus that includes a forming structure, a material loading structure, and a vacuum pumping structure. The forming structure consists of a forming furnace body with a heating cavity, a material waiting housing with a transition cavity, and a feeding pipe connecting both cavities. Additionally, a vacuum control valve is arranged on the feeding pipe to optimize the molding process.

Career Highlights

Jiang Ma is affiliated with Shenzhen University, where he continues to advance his research and development in molding technologies. His work is recognized for its technical depth and practical applications in the industry.

Collaborations

Jiang Ma collaborates with Jian Yang, contributing to various projects and research initiatives within the university.

Conclusion

Jiang Ma's innovative contributions to die molding technology exemplify the impact of dedicated research and development in the field of engineering. His work not only advances academic knowledge but also has practical implications for the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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