Berlin, Germany

Jiang Hongquan

This inventor holds 1 USPTO granted patent. Top assignee: Robert Bosch. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiang Hongquan. Retrieved from https://idiyas.com/inventor/jiang-hongquan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 59(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Innovator Spotlight: Jiang Hongquan

Introduction: Jiang Hongquan is a prominent inventor based in Berlin, Germany. With a remarkable contribution in the field of electronics, he has garnered attention through his innovative methodologies and patent filings.

Latest Patents: Jiang Hongquan holds a significant patent titled "Method for connecting electronic components to a substrate, and a method for checking such a connection." This invention addresses critical challenges in the electronics industry, enhancing the efficiency and reliability of connections between electronic components and substrates.

Career Highlights: Jiang is currently associated with Robert Bosch GmbH, a leading global supplier of technology and services. His work at Bosch focuses on improving electronic systems that have widespread applications in various sectors, including automotive and industrial technology.

Collaborations: Throughout his career, Jiang has collaborated with skilled professionals such as Jan Benzler and Albert-Andreas Hoebel. These partnerships have contributed to the development of innovative solutions that push the boundaries of electronic engineering.

Conclusion: Jiang Hongquan's work exemplifies the spirit of innovation within the electronics domain. With his patented method for connecting components, he continues to impact the industry positively through his role at Robert Bosch GmbH and beyond. His collaborative efforts only strengthen the potential for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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