Company Filing History:
Years Active: 2011
Title: Innovations by Jian Ming Yang in Semiconductor Technology
Introduction
Jian Ming Yang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, particularly in the area of die bonding systems. His innovative work has led to the development of advanced tools that enhance the efficiency of semiconductor manufacturing processes.
Latest Patents
Jian Ming Yang holds a patent for "Pick-up heads and systems for die bonding and related applications." This invention is particularly useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. The design features a head that includes a shank and a body, where the body has a compliant end portion that can be contacted by the shank. The shank's movement allows the face of the end portion to change from a planar contour to a convex contour, facilitating the adhesion of planar objects through a vacuum orifice connected to an evacuation device.
Career Highlights
Jian Ming Yang is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in improving the efficiency and effectiveness of die bonding processes, which are critical in the production of electronic devices.
Collaborations
Throughout his career, Jian Ming Yang has collaborated with talented individuals such as Ya Ping Wang and Guo Qiang Shen. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor manufacturing.
Conclusion
Jian Ming Yang's contributions to semiconductor technology through his innovative patents and collaborative efforts highlight his importance in the field. His work continues to influence the efficiency of manufacturing processes, making a significant impact on the industry.