Miau, Taiwan

Jian-Dih Jeng

This inventor holds 2 USPTO granted patents. Top assignee: Industrial Technology Research Institute. Active years: 1993-1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jian-Dih Jeng. Retrieved from https://idiyas.com/inventor/jian-dih-jeng-o4fgjs11

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 37(Granted Patents)


Location History:

  • Miau, TW (1993)
  • Hsinchu, TW (1994)

Company Filing History:


Years Active: 1993-1994

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2 patents (USPTO):Explore Patents

Title: Innovations of Jian-Dih Jeng

Introduction

Jian-Dih Jeng is a notable inventor based in Miau, Taiwan. He has made significant contributions to the field of thermal management in electronic devices. With a total of 2 patents, his work focuses on improving the efficiency and functionality of electronic components.

Latest Patents

One of Jian-Dih Jeng's latest patents is an "Apparatus for measuring heat of circuit module." This invention features a tubular housing made of thermally resistive material, designed to be placed over a circuit module. The apparatus ensures that heat flows along the axis of the housing, allowing for accurate temperature measurements. A thermal resistance is strategically located between two metal partitions, enabling the calculation of heat based on temperature drops. This design is adaptable for modules with varying power ratings, maintaining a consistent temperature drop.

Another significant patent is the "Fanless convection cooling design for personal computers." This invention describes an enclosure that houses a personal computer, utilizing natural convection to dissipate heat generated by electronic components. The design positions major heat-producing components at the top front of the cavity, ensuring efficient heat management. The master printed circuit board is attached to the rear side of the cavity, allowing for easy access to additional printed circuit boards, enhancing the computer's functionality.

Career Highlights

Jian-Dih Jeng is affiliated with the Industrial Technology Research Institute, where he continues to innovate in the field of thermal management. His work has been instrumental in developing solutions that enhance the performance and reliability of electronic devices.

Collaborations

Jian-Dih Jeng collaborates with Fang-Jun Leu, contributing to advancements in their respective fields. Their partnership exemplifies the importance of teamwork in driving innovation.

Conclusion

Jian-Dih Jeng's contributions to thermal management in electronics through his patents demonstrate his commitment to innovation. His work not only enhances the efficiency of electronic devices but also paves the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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