Jiajun Yang

Title: Jiajun Yang and a Memory Expansion Device

Introduction

Jiajun Yang is an inventor associated with Shenzhen, China, and Fullink Technology Co., Ltd. His listed patent concerns a memory expansion device designed to support computer memory expansion while providing a path for heat dissipation.

Latest Patents

Yang is credited with 1 patent. The patent, titled “Memory Expansion Device,” describes a shell containing a memory expansion component. The shell has a contact surface, a heat dissipation surface, and a heat conduction port that passes through both surfaces while remaining separate from the internal cavity holding the memory component.

When the shell’s contact surface meets the exterior of a computer host, the shell’s heat conduction port aligns with heat dissipation holes on the host’s bottom. This arrangement allows heat from the computer host to pass through the port toward the shell’s heat dissipation surface.

Career Highlights

Yang’s listed invention addresses the integration of memory expansion and thermal management. The design uses the relationship between the shell and the computer host to provide a route for transferring heat away from the host.

Collaborations

Yang is associated with Fullink Technology Co., Ltd. His listed coworkers include Danyun Mao and Xingquan Chen.

Conclusion

Jiajun Yang’s patent describes a memory expansion device that combines an internal memory component with a heat conduction path intended to help dissipate heat from a computer host.