Shanghai, China

Jiajie Tang

This inventor holds 2 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiajie Tang. Retrieved from https://idiyas.com/inventor/jiajie-tang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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2 patents (USPTO):Explore Patents

Title: Jiajie Tang: Innovator in Chip Packaging Technology

Introduction

Jiajie Tang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of chip packaging technology. With a total of 2 patents to his name, Tang is recognized for his innovative designs that enhance the performance and efficiency of electronic devices.

Latest Patents

One of Jiajie Tang's latest patents is a chip package device. This device includes a chip, a first substrate, and a second substrate that are positioned opposite each other. The chip is mounted on a surface of the first substrate that faces the second substrate. It is electrically connected to the first substrate through a first conductive part. The first substrate is then connected to the second substrate via a second conductive part. A heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. This design allows for efficient heat dissipation, ensuring that the chip maintains a normal operating temperature.

Another notable patent is a package structure with an antenna in package and communications device. This application describes a package structure that includes a substrate and a chip fastened beneath it. The antenna in the package features a first radiator, while the substrate consists of a core layer and a first conductor layer. The first radiator and a first conductive block are positioned on the first conductor layer. The package structure also includes a feed network that connects the chip to the antenna, providing necessary feeding for the communications device.

Career Highlights

Jiajie Tang is currently employed at Huawei Technologies Co., Limited, a leading global provider of information and communications technology (ICT) infrastructure and smart devices. His work at Huawei has allowed him to push the boundaries of chip packaging technology, contributing to the company's reputation for innovation.

Collaborations

Throughout his career, Jiajie Tang has collaborated with notable colleagues, including Laicun Lin and Liangsheng Liu. These collaborations have fostered an environment of creativity and innovation, leading to advancements in their respective fields.

Conclusion

Jiajie Tang is a distinguished inventor whose work in chip packaging technology has made a significant impact on the electronics industry. His innovative patents demonstrate his commitment to enhancing device performance and efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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