Seattle, WA, United States of America

Jiahua Kang

This inventor holds 1 USPTO granted patent. Top assignee: Amazon Technologies, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiahua Kang. Retrieved from https://idiyas.com/inventor/jiahua-kang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jiahua Kang and Cloud Database Heat Management.

Introduction

Jiahua Kang is an inventor based in Seattle, Washington. His patent work addresses resource management in cloud computing, with a focus on placing database instances on host systems according to their resource usage.

Latest Patents

Kang is associated with 1 patent, titled “Heat Management in a Serverless Managed Database Service in a Cloud Provider Network.” The invention describes a service that receives a request to launch a database instance capable of scaling its resource usage in response to an application’s computing demands. The service identifies candidate host computer systems, obtains a resource-usage metric for each candidate, and selects a host based at least in part on those metrics. It then launches the database instance on the selected host.

Career Highlights

Kang is associated with Amazon Technologies, Inc. His patent highlights work on managing host selection for serverless database services, where resource-aware placement can help accommodate changing application demands.

Collaborations

Kang’s listed coworkers include Yuhui Yuan and Ashok Kurakula. Their shared association provides context for the professional environment surrounding his patent work.

Conclusion

Jiahua Kang’s patent focuses on resource-aware placement of scalable database instances in a cloud provider network, connecting his work with the practical challenges of managing serverless computing services.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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