Taipei, Taiwan

Jia-Rung Tsai

This inventor holds 1 USPTO granted patent. Top assignee: Compal Electronics, Inc.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jia-Rung Tsai. Retrieved from https://idiyas.com/inventor/jia-rung-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations by Jia-Rung Tsai

Introduction

Jia-Rung Tsai is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic devices, particularly with his innovative designs that enhance functionality and support.

Latest Patents

One of his key patents is titled "Electronic device having fan module with reinforcing structure." This invention involves an electronic apparatus that includes a casing, a fan module, and at least one reinforcing structure. The casing features a lateral side, while the fan module is strategically located within the casing. The reinforcing structure is positioned between the lateral side and the fan module, serving to enhance the support strength of the casing in that area. Jia-Rung Tsai holds 1 patent for this invention.

Career Highlights

Jia-Rung Tsai is currently employed at Compal Electronics, Inc., a leading company in the electronics manufacturing sector. His work focuses on developing innovative solutions that improve the performance and durability of electronic devices.

Collaborations

Some of his notable coworkers include Hsin-Yi Wu and Ming-Wang Lin, who contribute to the collaborative efforts in their projects.

Conclusion

Jia-Rung Tsai's contributions to electronic device innovation demonstrate his commitment to enhancing technology through thoughtful design. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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