Shenzhen, China

Jia-Jie Chen


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2012

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2 patents (USPTO):Explore Patents

Title: Innovations of Jia-Jie Chen

Introduction

Jia-Jie Chen is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of bonding technology, holding a total of 2 patents. His work reflects a commitment to advancing manufacturing processes through innovative solutions.

Latest Patents

Jia-Jie Chen's latest patents include a bonding apparatus and a bonding method. The bonding apparatus features a frame, a first feeding mechanism, a second feeding mechanism, and a bonding mechanism. The first feeding mechanism is equipped with a turntable that can rotate relative to the frame, with multiple workpiece seats arranged on it. Each workpiece seat is designed with several first air holes. The second feeding mechanism consists of a first carrier and a second carrier, where the first carrier has multiple holding seats and the second carrier includes temporary holding seats. The first carrier can rotate to stack on the second carrier, and each holding seat has several second air holes. The bonding mechanism is movably mounted on the frame to align with the workpiece seats or the second carrier. The bonding method utilizes this apparatus, incorporating similar features to enhance efficiency in bonding processes.

Career Highlights

Throughout his career, Jia-Jie Chen has worked with prominent companies such as Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd. and Hon Hai Precision Industry Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Jia-Jie Chen has collaborated with notable colleagues, including Dong-Sheng Lin and Tzyy-Chyi Tsai. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Jia-Jie Chen's contributions to bonding technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of manufacturing processes.

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