Company Filing History:
Years Active: 2014-2021
Title: Innovator Jia-Hung Tseng: Pioneering Micro Device Assembly
Introduction
Jia-Hung Tseng is a prominent inventor based in Portland, OR, with a remarkable portfolio of seven patents. He has made significant contributions to the field of micro device assembly, particularly in the development of advanced display technologies. His innovative work continues to shape the industry and push the boundaries of electronic display manufacturing.
Latest Patents
One of Jia-Hung Tseng's latest patents focuses on a display that includes an LED element utilizing a pressure-sensitive adhesive (PSA) for micro pick and bond assembly. This invention specifically addresses the micro pick-and-bond heads that transfer micro device elements, such as micro LEDs, en masse from a source substrate to a target substrate, like an LED display substrate. The design incorporates anchor and release structures to facilitate the separation of device elements from the source substrate. The use of PSA allows for temporary affixation of device elements to the micro pick-and-bond head pedestals, and once permanently affixed to the target substrate, the PSA interface can be effectively released through peeling or thermal decomposition.
Career Highlights
Jia-Hung Tseng is currently employed at Intel Corporation, where he leverages his expertise in display technology and micro fabrication techniques. His career at Intel has enabled him to work on groundbreaking projects that enhance the performance and efficiency of electronic displays. His inventive methods not only improve production processes but also contribute to the overall advancement of display technologies.
Collaborations
Throughout his career, Tseng has collaborated closely with fellow innovators such as Peter Chang and Chytra Pawashe. These partnerships have fostered a dynamic exchange of ideas and expertise, resulting in innovative solutions and significant advancements in their respective fields of research. Their collective efforts have strengthened the development of micro pick-and-bond technology and its applications in the electronics industry.
Conclusion
Jia-Hung Tseng stands out as a leading inventor in the realm of micro device assembly and display technology. With his seven patents, he is making notable contributions to how micro devices are manufactured and implemented in modern displays. As the industry evolves, his work continues to inspire advancements that will shape the future of electronic displays and their applications across various sectors.