Hsinchu, Taiwan

Jia-Hung Su

This inventor holds 2 USPTO granted patents. Top assignee: Wistron Neweb Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jia-Hung Su. Retrieved from https://idiyas.com/inventor/jia-hung-su-qzyn4syd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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2 patents (USPTO):Explore Patents

Title: Innovations of Jia-Hung Su

Introduction

Jia-Hung Su is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of communication technology, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

His latest patents include a communication device that features a dielectric substrate, an antenna layer, a metamaterial layer, and multiple absorber elements. This device is designed to enhance communication capabilities through advanced materials and structures. Another patent focuses on an antenna module, a metamaterial structure, and an electronic device. This invention incorporates a housing, a glass material layer, and an antenna module that utilizes a unique arrangement of metal conductors to optimize performance.

Career Highlights

Jia-Hung Su is currently employed at Wistron Neweb Corporation, where he continues to push the boundaries of technology. His work is characterized by a commitment to innovation and excellence in the field of electronic communications.

Collaborations

He collaborates with talented coworkers such as Kai Shih and Cheng-Geng Jan, contributing to a dynamic and creative work environment.

Conclusion

Jia-Hung Su's contributions to communication technology through his patents reflect his dedication to innovation and advancement in the field. His work at Wistron Neweb Corporation positions him as a key player in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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