Champaign, IL, United States of America

Jia En Aw


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations in 3D Printing by Jia En Aw

Introduction

Jia En Aw is an accomplished inventor based in Champaign, Illinois. She has made significant contributions to the field of 3D printing, particularly in the development of thermoset polymers and composites. Her innovative approach has the potential to revolutionize the manufacturing of robust 3D-printed devices.

Latest Patents

Jia En Aw holds a patent for a novel method of 3D printing using frontal polymerization chemistry. This method enables the printing of tough, high-quality thermosets in a short time frame, with the option of adding fiber reinforcement. This advancement facilitates the fabrication of mechanically robust 3D-printed devices and structures, showcasing her expertise in the field.

Career Highlights

Jia En Aw is affiliated with the University of Illinois, where she continues to push the boundaries of 3D printing technology. Her work has garnered attention for its innovative approach and practical applications in various industries.

Collaborations

Some of her notable coworkers include Jeffrey S. Moore and Scott R. White, who have collaborated with her on various projects related to her patent and research.

Conclusion

Jia En Aw's contributions to 3D printing technology exemplify the innovative spirit of modern inventors. Her work not only enhances the capabilities of 3D printing but also paves the way for future advancements in the field.

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