Chino Hills, CA, United States of America

Jia De Peng


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2020

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2 patents (USPTO):Explore Patents

Title: Innovations by Jia De Peng in Chemical Mechanical Polishing

Introduction

Jia De Peng is an accomplished inventor based in Chino Hills, CA (US). He has made significant contributions to the field of chemical mechanical polishing, particularly in the development of compositions and methods that enhance the performance of tungsten substrates. With a total of 2 patents, his work is recognized for its innovative approach to improving substrate polishing processes.

Latest Patents

Jia De Peng's latest patents focus on a chemical mechanical polishing composition and method specifically designed for tungsten. The first patent describes a composition that includes water, an oxidizing agent, a select polyethoxylated tallow amine, a dicarboxylic acid, a source of iron ions, a colloidal silica abrasive, and optional components such as a pH adjusting agent and a biocide. This composition aims to inhibit corrosion of tungsten during the polishing process. The method involves using a chemical mechanical polishing pad to create dynamic contact with the substrate, allowing for effective polishing while minimizing corrosion.

The second patent reiterates the same innovative approach, emphasizing the importance of the components used in the polishing composition. The method remains consistent, focusing on the interaction between the polishing pad and the substrate to achieve optimal results.

Career Highlights

Jia De Peng is currently employed at Rohm and Haas Electronic Materials CMP Holdings, Inc. His role at the company allows him to apply his expertise in chemical mechanical polishing, contributing to advancements in the field. His work has garnered attention for its practical applications in various industries.

Collaborations

Throughout his career, Jia has collaborated with notable colleagues, including Lin-Chen Ho and Benson Po-Hsiang Chi. These collaborations have fostered a productive environment for innovation and development in chemical mechanical polishing technologies.

Conclusion

Jia De Peng's contributions to the field of chemical mechanical polishing demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in polishing tungsten substrates, paving the way for advancements in the industry.

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