This inventor holds 2 USPTO granted patents. Top assignee: Skhynix Inc.. Active years: 2021-2022.
Company Filing History:
Years Active: 2021-2022
Title: Innovations by Ji Yeong Yoon
Introduction
Ji Yeong Yoon is a notable inventor based in Hwaseong, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
One of Ji Yeong Yoon's latest patents is titled "Stack semiconductor packages having wire-bonding connection structure." This invention describes a semiconductor package that includes a package substrate with a unique hole pattern. The design features a first through hole extending in one direction and a second through hole extending in a perpendicular direction. The package accommodates at least one first semiconductor chip and one second semiconductor chip, both of which are connected to the package substrate through bonding wires.
Another significant patent is related to semiconductor packages, detailing a package substrate that includes multiple pad bonding portions. The design incorporates first to third via landing portions and connection trace portions that are strategically arranged to enhance connectivity. This innovation aims to improve the overall performance and reliability of semiconductor packages.
Career Highlights
Ji Yeong Yoon is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His work at SK Hynix has allowed him to collaborate with other talented professionals in the field, contributing to advancements in semiconductor technology.
Collaborations
Some of Ji Yeong Yoon's coworkers include Jae Hoon Lee and Sun Kyu Kong. Their collaborative efforts have played a crucial role in the development of innovative semiconductor solutions.
Conclusion
Ji Yeong Yoon's contributions to semiconductor technology through his patents and work at SK Hynix Inc. highlight his importance in the field. His innovations continue to influence the development of advanced semiconductor packages, showcasing his expertise and dedication to the industry.