Ji-Ping Li

Title: The Innovative Contributions of Ji-Ping Li

Introduction

Ji-Ping Li is a notable inventor based in Fremont, CA, who has made significant contributions to the field of semiconductor fabrication. With a total of five patents to his name, he has developed innovative methods that enhance the quality and reliability of damascene structures, which are crucial in the manufacturing of integrated circuits.

Latest Patents

One of Ji-Ping Li's latest patents focuses on evaluating a multi-layered structure for voids. This method and apparatus measure properties of two layers of a damascene structure, such as a silicon wafer during fabrication. By utilizing two measurements, the invention identifies locations that may contain voids. The two measurements can be compared, and voids are determined to be present when the measurements diverge from each other. In response to the detection of voids, process parameters used in the fabrication of the damascene structure can be adjusted to reduce or eliminate these voids in future structures.

Career Highlights

Throughout his career, Ji-Ping Li has worked with prominent companies in the semiconductor industry, including Applied Materials, Inc. and Boxer Cross, Inc. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.

Collaborations

Ji-Ping Li has collaborated with various professionals in his field, including his coworker Peter G. Borden. These collaborations have fostered an environment of innovation and have led to the development of groundbreaking technologies.

Conclusion

Ji-Ping Li's work exemplifies the spirit of innovation in the semiconductor industry. His patents and career achievements highlight his commitment to improving fabrication processes and ensuring the reliability of electronic components. His contributions continue to influence the field and inspire future advancements.