Ji Na Jeung

Title: The Innovations of Ji Na Jeung

Introduction

Ji Na Jeung is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative solutions that enhance the performance and efficiency of semiconductor packages.

Latest Patents

Ji Na Jeung holds a patent for a "Hybrid interposer and semiconductor package including the same." This patent describes a semiconductor package that features an organic frame with opposing surfaces, a cavity, and a wiring structure that connects these surfaces. The package includes a connection structure on the organic frame's surface, an inorganic interposer with interconnection wiring, and an encapsulant that protects the interposer. Additionally, it has an insulating layer and a second redistribution layer with multiple pads, along with at least one semiconductor chip connected to these pads.

Career Highlights

Ji Na Jeung is currently employed at Samsung Electro-Mechanics Co., Ltd. His role at the company allows him to work on cutting-edge technologies in the semiconductor industry. His innovative approach has contributed to advancements in semiconductor packaging.

Collaborations

Some of Ji Na Jeung's coworkers include Job Ha and Sung Hyun Kim. Their collaboration fosters a creative environment that encourages innovation and the development of new technologies.

Conclusion

Ji Na Jeung's contributions to semiconductor technology exemplify the impact of innovation in the industry. His patent and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as a key inventor in advancing semiconductor solutions.