Icheon, South Korea

Ji Hyeok Shin

This inventor holds 2 USPTO granted patents. Top assignee: Skhynix Inc.. Active years: 2020-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ji Hyeok Shin. Retrieved from https://idiyas.com/inventor/ji-hyeok-shin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2022

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2 patents (USPTO):Explore Patents

Title: Ji Hyeok Shin: Innovator in Semiconductor Technology

Introduction

Ji Hyeok Shin is a prominent inventor based in Icheon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to enhancing semiconductor packages.

Latest Patents

One of Ji Hyeok Shin's latest patents involves semiconductor packages that include a heat insulation wall. This design features a first semiconductor chip and a second semiconductor chip that are positioned side-by-side on a package substrate. The heat insulation wall is strategically placed between the two chips, providing thermal isolation. This innovation helps to improve the performance and reliability of semiconductor devices.

Career Highlights

Ji Hyeok Shin is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His work focuses on developing advanced packaging solutions that enhance the efficiency and functionality of semiconductor products.

Collaborations

Throughout his career, Ji Hyeok Shin has collaborated with notable colleagues, including Min Kyu Kang and Jae Hyun Son. These partnerships have contributed to the advancement of semiconductor technologies and have fostered a collaborative environment for innovation.

Conclusion

Ji Hyeok Shin's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of more efficient and reliable semiconductor packages.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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