Hwaseong-si, South Korea

Ji-Hwan Hwang


Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 31(Granted Patents)


Company Filing History:


Years Active: 2018-2024

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8 patents (USPTO):Explore Patents

Title: The Innovations of Ji-Hwan Hwang

Introduction

Ji-Hwan Hwang is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work is primarily associated with Samsung Electronics Co., Ltd., where he has been instrumental in developing advanced semiconductor packages.

Latest Patents

One of Ji-Hwan Hwang's latest patents focuses on a semiconductor package having high reliability. This innovative package includes a package substrate and a plurality of semiconductor devices stacked on it. It features underfill fillets disposed between the semiconductor devices and the package substrate, along with a molding resin that partially surrounds these components. Notably, the underfill fillets contain protrusions that extend from the spaces between the semiconductor devices, creating a continuous structure without interfaces between neighboring protrusions.

Career Highlights

Throughout his career, Ji-Hwan Hwang has been recognized for his expertise in semiconductor packaging. His innovative designs have contributed to the reliability and efficiency of semiconductor devices, making them essential in various electronic applications. His work at Samsung Electronics Co., Ltd. has positioned him as a key player in the industry.

Collaborations

Ji-Hwan Hwang has collaborated with notable colleagues, including Sang-Sick Park and Tae-Hong Min. These partnerships have fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Ji-Hwan Hwang's contributions to semiconductor technology exemplify the importance of innovation in the electronics industry. His patents reflect a commitment to enhancing the reliability and performance of semiconductor packages. His work continues to influence the future of technology.

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