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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10886255 B1

PDFFull Text
Date of Patent:
Jan. 05, 2021

Filed:

Aug. 06, 2019

Die stack structure, semiconductor package having the same and method of manufacturing the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Ji-Seok Hong, Yongin-si, KR;

Ji-Hoon Kim, Asan-si, KR;

Tae-Hun Kim, Asan-si, KR;

Hyuek-Jae Lee, Hwaseong-si, KR;

Ji-Hwan Hwang, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 21/822 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/56 (2013.01); H01L 21/8221 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/3185 (2013.01); H01L 23/481 (2013.01); H01L 23/5386 (2013.01); H01L 24/08 (2013.01); H01L 2224/08145 (2013.01); H01L 2924/18301 (2013.01);
Abstract

A die stack structure may include a base die having base contact pads insulated by a base protection patterns and a flat side surface, a die stack bonded to the base die and having a plurality of component dies on the base die such that each of the component dies includes component contact pads insulated by a corresponding component protection pattern, and a residual mold unevenly arranged on a side surface of the die stack such that the component dies are attached to each other by the residual mold.

Find Patent Forward Citations

Hong, Ji-Seok. (2021). Die stack structure, semiconductor package having the same and method of manufacturing the same (U.S. Patent No. 10886255). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10886255

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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