This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Curwood, Inc.. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: Jesten David Neill: Innovator in Packaging Technology
Introduction
Jesten David Neill is an accomplished inventor based in Oshkosh, WI (US). He holds a patent for a unique packaging sheet that enhances cutting properties, showcasing his innovative approach to materials science.
Latest Patents
Neill's notable patent is for a packaging sheet with improved cutting properties. This non-oriented thermoformable packaging sheet features a rigid component layer made from a blend of an aromatic polyester and a styrenic polymer. The formulation ensures that the total amount of styrenic polymer present in the sheet is between 3.0% and 4.0% by weight. The packaging sheet has a minimum thickness of 5 mil and a normalized impact strength of 0.16 ft*lbf/mil or less, as measured by the ASTM D3763-08 test method. He has 1 patent to his name.
Career Highlights
Throughout his career, Neill has worked with notable companies such as Curwood, Inc. and Bemis Company, Inc. His experience in these organizations has contributed to his expertise in packaging technology and materials development.
Collaborations
Neill has collaborated with talented individuals in his field, including Curtis Randolph Barr and Connie Louise Gherena. These partnerships have likely enriched his work and led to further advancements in packaging solutions.
Conclusion
Jesten David Neill is a significant figure in the realm of packaging innovation, with a focus on improving material properties for practical applications. His contributions continue to influence the industry and pave the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile