Jericho J Jacala

Title: Jericho J Jacala: Innovator in Integrated Circuit Testing

Introduction

Jericho J Jacala is a notable inventor based in Murray Hill, NJ (US). He has made significant contributions to the field of integrated circuit testing, showcasing his expertise through his innovative patent.

Latest Patents

Jericho J Jacala holds a patent titled "Methods and apparatus for testing integrated circuits." This patent describes an integrated circuit (IC) test apparatus featuring a test bed with sockets designed to engage arrays of I/O solder balls or bumps on the IC chip. One embodiment of the invention includes sockets with through holes that interconnect the solder bumps to the next board level, minimizing electrical path length and reducing parasitic capacitive coupling. Another embodiment utilizes intersecting V-grooves to form the sockets, which produce pyramid-shaped features at the bottom of each socket. These sharp edges and pyramid shapes enhance contact between the solder bumps and the test bed. The test bed can be designed as a universal blank for a specific solder bump pitch, with the desired test circuit formed at the next board level.

Career Highlights

Jericho J Jacala is currently employed at Agere Systems Inc., where he continues to apply his knowledge and skills in the field of integrated circuits. His work has contributed to advancements in testing methodologies that are crucial for the development of reliable electronic devices.

Collaborations

Throughout his career, Jericho has collaborated with esteemed colleagues, including Dean Paul Kossives and Yinon Degani. These partnerships have fostered innovation and have been instrumental in the development of new technologies in the industry.

Conclusion

Jericho J Jacala's contributions to integrated circuit testing through his innovative patent demonstrate his commitment to advancing technology. His work at Agere Systems Inc. and collaborations with other professionals highlight his role as a key player in the field.