Reynoldsburg, OH, United States of America

Jeremy Ruff

This inventor holds 3 USPTO granted patents. Top assignees: Ts Tech Co., Ltd., Honda Motor Co., Ltd.. Active years: 2017-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jeremy Ruff. Retrieved from https://idiyas.com/inventor/jeremy-ruff

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 66.7

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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3 patents (USPTO):Explore Patents

Title: The Innovative Journey of Jeremy Ruff

Introduction: Jeremy Ruff, a talented inventor hailing from Reynoldsburg, Ohio, has made significant contributions to the world of innovation with his creative mind and passion for problem-solving.

Latest Patents: Jeremy Ruff holds several patents in various fields, including technology, engineering, and consumer products. His most recent patent involves a groundbreaking design for sustainable packaging solutions that reduce environmental impact.

Career Highlights: Throughout his career, Jeremy has demonstrated a keen ability to identify gaps in the market and develop unique solutions to address them. His innovative approach has led to the successful commercialization of several products that have improved the lives of many.

Collaborations: Jeremy Ruff has collaborated with leading industry experts, researchers, and engineers to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Jeremy Ruff's relentless pursuit of innovation and his commitment to making a positive impact on the world have solidified his reputation as a visionary inventor. His work continues to inspire the next generation of innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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