Company Filing History:
Years Active: 1999-2003
Title: Innovator Jeremias L. Libres: Pioneering Advances in Integrated Circuit Encapsulation
Introduction
Jeremias L. Libres is a notable inventor based in Dallas, TX, who has made significant contributions to the field of integrated circuit encapsulation. With a total of 8 patents to his name, Libres has developed innovative methods that enhance the efficiency and reliability of electronic components.
Latest Patents
Among his latest patents, Libres has introduced groundbreaking technologies such as the "Sproutless Pre-Packaged Molding for Component Encapsulation." This invention outlines a method and apparatus for encapsulating integrated circuit die and leadframe assemblies. The process involves using a prepackaged sproutless mold compound insert that is strategically placed in a rectangular receptacle within a bottom mold chase. This design allows for precise placement of leadframe strip assemblies, ensuring that integrated circuit dies are centered over the corresponding die cavities. The innovative use of a plunger to control the filling rate of the mold compound minimizes voids and enhances the overall quality of the encapsulated components.
Another significant patent is the "Method for Manufacturing Prepackaged Molding Compound for Component." This invention details a method for providing a prepackaged mold compound that simplifies the encapsulation process. The mold compound is packaged in a plastic film with peelable seals, which are released during the molding process. This design allows for efficient filling of the cavities while maintaining the integrity of the bond wires in the integrated circuit assemblies.
Career Highlights
Libres is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new technologies in the field of electronics. His work has not only advanced the capabilities of integrated circuits but has also contributed to the overall progress of the electronics industry.
Collaborations
Throughout his career, Libres has collaborated with talented individuals such as Mario A. Bolanos and Ireneus J. Pas. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Jeremias L. Libres stands out as a prominent inventor whose work in integrated circuit encapsulation has paved the way for advancements in electronic manufacturing. His innovative patents reflect a commitment to improving the efficiency and reliability of electronic components, making a lasting impact on the industry.