Cheonan-si, South Korea

Jeongseok Kim

USPTO Granted Patents = 23 

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • Suwon-si, KR (2021 - 2024)
  • Cheonan-si, KR (2022 - 2024)

Company Filing History:


Years Active: 2021-2025

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23 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Jeongseok Kim and His Contributions to Semiconductor Technology

Introduction: Jeongseok Kim, based in Cheonan-si, South Korea, is a prominent figure in the realm of semiconductor technology. With a total of 20 patents to his name, Kim has made significant contributions to the field, particularly in the design and manufacturing of semiconductor packages. His innovative approaches have positioned him as a key player in the industry.

Latest Patents: Among his latest patents are groundbreaking designs for semiconductor packages. One notable patent discloses a comprehensive semiconductor package that includes a package substrate and an interposer substrate. This invention features a first and second redistribution substrate, an interposer molding layer, and strategically placed semiconductor chips that enhance performance and connectivity. Another patent provides a novel method for manufacturing semiconductor packages with a support substrate housing connection wirings and capacitors. This design includes a redistribution wiring layer that connects semiconductor chips to outer connectors, ensuring efficient electrical performance.

Career Highlights: Jeongseok Kim has spent his career at Samsung Electronics Co., Ltd., where he has been instrumental in advancing semiconductor technologies. His work has influenced the way modern electronic devices are designed and manufactured, contributing to both consumer and industrial applications. Kim's expertise in semiconductor packaging has positioned him as a noteworthy inventor within the organization.

Collaborations: Throughout his career, Kim has collaborated with talented colleagues, including Myungsam Kang and Youngchan Ko. Their collective efforts have fostered an environment of innovation within the company, driving forward new ideas and technologies that continue to shape the semiconductor landscape.

Conclusion: Jeongseok Kim's contributions to semiconductor packaging exemplify the spirit of innovation in the technology sector. With a robust portfolio of patents and collaborations with other skilled professionals, Kim is poised to continue making an impact in the field, paving the way for future advancements in semiconductor technology. His work reflects the ongoing evolution of electronic devices and the importance of innovation in meeting the demands of modern society.

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