Cheonan, South Korea

Jeongsang Yu

This inventor holds 1 USPTO granted patent. Top assignee: Amosense Co., Ltd. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jeongsang Yu. Retrieved from https://idiyas.com/inventor/jeongsang-yu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Jeongsang Yu: Innovator in Flexible PCB RF Cable Technology

Introduction

Jeongsang Yu is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of flexible printed circuit board (PCB) technology. His innovative work focuses on enhancing the durability and functionality of RF cables.

Latest Patents

Jeongsang Yu holds a patent for a flexible PCB RF cable. This invention features a unique design that includes a ground pattern divided into two sections, connected through a specialized connection pattern. This design minimizes the risk of cracks during bending, thereby improving the cable's longevity and performance.

Career Highlights

Throughout his career, Jeongsang Yu has demonstrated a commitment to innovation in electronic components. His work at Amosense Co., Ltd. has positioned him as a key player in the development of advanced PCB technologies. His patent reflects his expertise and dedication to solving practical challenges in the industry.

Collaborations

Jeongsang Yu has collaborated with talented colleagues, including Jeonggeun Heo and Seho Lee. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Jeongsang Yu's contributions to flexible PCB RF cable technology exemplify his innovative spirit and dedication to improving electronic components. His patent showcases his ability to address industry challenges effectively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…