Suwon-si, South Korea

Jeongkyu Ha

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jeongkyu Ha. Retrieved from https://idiyas.com/inventor/jeongkyu-ha-oos9a646

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jeongkyu Ha: Innovator in Semiconductor Packaging

Introduction

Jeongkyu Ha is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods.

Latest Patents

One of Jeongkyu Ha's notable patents is for a semiconductor package and method of manufacturing the semiconductor package. This invention includes a film substrate, a plurality of wires on the upper surface of the film substrate, and an upper insulating film that covers the wires while defining pad openings and a mounting region opening. The design allows for effective bonding and electrical connection of a semiconductor chip to the exposed inner lead bonding portion, enhancing the overall functionality of semiconductor packages. Jeongkyu Ha holds 1 patent in this area.

Career Highlights

Jeongkyu Ha is currently employed at Samsung Electronics Ltd., a leading company in the technology sector. His work focuses on advancing semiconductor technologies, contributing to the company's reputation for innovation and quality in electronic products.

Collaborations

Throughout his career, Jeongkyu Ha has collaborated with talented colleagues, including Narae Shin and Youngbae Kim. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Jeongkyu Ha's contributions to semiconductor packaging exemplify his innovative spirit and dedication to advancing technology. His work continues to impact the industry positively, making him a noteworthy figure in the field of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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