Jeong-Ok Cha

Title: Jeong-Ok Cha: Innovator in Wiring Structures

Introduction

Jeong-Ok Cha is a prominent inventor based in Seoul, South Korea. She has made significant contributions to the field of wiring structures, particularly in semiconductor technology. Her innovative methods have paved the way for advancements in electronic devices.

Latest Patents

Jeong-Ok Cha holds a patent for "Methods of forming wiring structures including a plurality of metal layers." This patent describes a method of forming a wiring structure where a lower structure is created on a substrate. An insulating interlayer is then formed on this lower structure. The insulating interlayer is partially removed to create at least one via hole and a dummy via hole. Subsequently, an upper portion of the insulating interlayer is partially removed to form a trench that connects the via hole and the dummy via hole. A first metal layer is then formed to fill both the via hole and the dummy via hole, followed by a second metal layer that fills the trench on top of the first metal layer. This innovative approach enhances the efficiency and reliability of wiring structures in electronic applications.

Career Highlights

Jeong-Ok Cha is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. Her work at Samsung has allowed her to collaborate with some of the brightest minds in the industry, contributing to groundbreaking advancements in technology.

Collaborations

Throughout her career, Jeong-Ok Cha has worked alongside talented colleagues, including Jong-Jin Lee and Rak-Hwan Kim. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

Jeong-Ok Cha's contributions to the field of wiring structures exemplify her dedication to innovation and excellence. Her patent and work at Samsung Electronics Co., Ltd. highlight her role as a key player in advancing semiconductor technology.