Jeong Hwan Im

Title: Jeong Hwan Im: Innovator in Multilayer Electronic Components

Introduction

Jeong Hwan Im is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of multilayer electronic components, holding a total of 2 patents. His work is primarily associated with Samsung Electro-Mechanics Co., Ltd., where he continues to innovate and develop advanced technologies.

Latest Patents

Jeong Hwan Im's latest patents include a multilayer chip bead and a multilayer electronic component. The multilayer chip bead features a body that includes a coil portion and cover layers on both upper and lower surfaces. It also has first and second external electrodes on the external surfaces of the body, with a coil disposed in the coil portion. This coil includes spiral-shaped coil patterns and lead patterns, with the lead pattern width being smaller than that of the coil pattern. The multilayer electronic component consists of a multilayer body with multiple insulating layers and an internal coil part that connects conductive patterns. Additionally, it has first and second external electrodes on both end surfaces of the multilayer body.

Career Highlights

Throughout his career, Jeong Hwan Im has focused on developing innovative electronic components that enhance performance and efficiency. His work at Samsung Electro-Mechanics Co., Ltd. has positioned him as a key player in the industry, contributing to advancements in multilayer technology.

Collaborations

Jeong Hwan Im has collaborated with talented coworkers, including So Young Jun and Hyun Ju Jung. Their combined efforts have led to the successful development of cutting-edge electronic components.

Conclusion

Jeong Hwan Im is a distinguished inventor whose work in multilayer electronic components has made a significant impact in the field. His patents reflect his commitment to innovation and excellence in technology.