Trofaiach, Austria

Jens Riedler

USPTO Granted Patents = 4 

Average Co-Inventor Count = 3.3

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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4 patents (USPTO):Explore Patents

Title: Jens Riedler: Innovator in Component Carrier Technology

Introduction

Jens Riedler is a notable inventor based in Trofaiach, Austria. He has made significant contributions to the field of component carrier technology, holding a total of 4 patents. His work focuses on innovative methods and materials that enhance the functionality and efficiency of electronic components.

Latest Patents

Riedler's latest patents include a "Component carrier interconnection and manufacturing method." This invention describes a component carrier assembly that features a first component carrier with an electrically insulating layer structure and a via filled with conductive material. The design allows for effective interconnection between two component carriers, enhancing their performance. Another notable patent is for a "Component carrier with a via containing a hardened filling material." This invention involves a component carrier that utilizes a photosensitive fill material, which undergoes hardening treatment through electromagnetic radiation, improving the structural integrity of the component.

Career Highlights

Jens Riedler is currently employed at AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading company in the field of high-tech printed circuit boards and advanced packaging solutions. His role at AT&S has allowed him to push the boundaries of innovation in component carrier technology.

Collaborations

Throughout his career, Riedler has collaborated with talented individuals such as Abderrazzaq Ifis and Christopher Hermann. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the industry.

Conclusion

Jens Riedler's contributions to component carrier technology exemplify his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving electronic component design and manufacturing processes.

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