Company Filing History:
Years Active: 2004-2015
Title: An Insight into Inventor Jens Paul and His Contributions to Chip Technology
Introduction
Jens Paul, an inventive mind located in Dresden, Germany, has made significant strides in the area of integrated circuit packaging technology. With a total of three patents to his name, his work showcases innovative approaches that have the potential to transform the industry’s standards and practices.
Latest Patents
Among Jens Paul’s latest innovations is a patent for a pillar structure utilized in packaging integrated circuit products. This pillar design consists of a bond pad that is conductively linked to an integrated circuit, along with a pillar featuring a base with a first lateral dimension. This base connects to the bond pad while having an upper portion that is conductively coupled to the base, with a second lateral dimension that is notably less than the first.
Another notable patent focuses on an arrangement aimed at reducing stress in substrate-based chip packages, particularly in Ball Grid Arrays (BGA) with rear-side and/or edge protection. In this arrangement, the chip is securely connected to a substrate that includes conducting tracks and micro-balls for electrical contact with the next higher wiring level. By introducing regular trench-shaped structures into the substrate, surrounding the chip, the invention effectively mitigates thermally induced mechanical stress, enhancing durability and performance.
Career Highlights
Jens Paul has built an impressive career in the field of semiconductor technology. He has worked with leading companies such as Infineon Technologies AG and GlobalFoundries Inc., where he has honed his skills and contributed to groundbreaking innovations in chip design and packaging.
Collaborations
Throughout his career, Jens has collaborated with various talented professionals, including Dirk Breuer and Frank G. Kuechenmeister. Their collective expertise in the industry has contributed to the successful development and implementation of innovative solutions in integrated circuit technology.
Conclusion
Jens Paul stands out as a prominent inventor in the semiconductor field, bringing forth essential innovations that address the challenges in integrated circuit packaging. His patents not only reflect his technical acumen but also highlight the collaborative nature of technological advancement, underscoring the importance of teamwork in driving innovation.