Infineon Technologies Ag

Globalfoundries Inc.

Jens Paul

Frank G Kuechenmeister

Martin Reiss

Dirk Breuer

Detlef Nagel

Kashi Vishwanath Machani

Hanns-Georg Ochsenk&uuml;hn

Reinhart Buhr

One illustrative pillar disclosed herein includes a bond pad conductively coupled to an integrated circuit and a pillar comprising a base that is conductively coupled to the bond pad, wherein the base has a first lateral dimension, and an upper portion that is conductively coupled to the base, wherein the upper portion has a second lateral dimension that is less than the first lateral dimension. A method disclosed herein of forming a pillar includes forming a base such that it is conductively coupled to a bond pad on an integrated circuit product and, after forming the base, forming an upper portion such that it is conductively coupled to the base.

Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure

An arrangement reduces stress in substrate-based chip packages, in particular of Ball Grid Arrays (BGA) with rear-side and/or edge protection. The chip is firmly connected to a substrate, which is provided on the side that is opposite from the chip with conducting tracks and micro-balls for making electrical contact with the next-higher wiring level. Regular trench-shaped structures are introduced into the substrate on the chip side thereof and at least enclosing the chip, in order to interrupt or shift the thermally induced mechanical stress in the substrate, indicated by the chip.

Arrangement for reducing stress in substrate-based chip packages

An electrical component contains a pad formed of an electrically conductive material. The pad serves for the application of a contact element and is complemented by an electrically conductive edge strip. The pad and the edge strip are isolated from one another. The component which includes the pad on which misalignments or deformations of contact elements which occur in a functionality test can be detected easily and directly without additional analytical devices.

Electrical component with a contact and method for forming a contact on a semiconductor material

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Dresden, Germany

Jens Paul