Munich, Germany

Jens-Oliver Adam

This inventor holds 1 USPTO granted patent and 2 EPO patents. Top assignee: Texmag Gmbh Vertriebsgesellschaft. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jens-Oliver Adam. Retrieved from https://idiyas.com/inventor/jens-oliver-adam

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Jens-Oliver Adam: Innovator in Electronic Component Integration

Introduction

Jens-Oliver Adam is a notable inventor based in Munich, Germany. He has made significant contributions to the field of material processing, particularly in integrating electronic components into materials. His innovative approach has led to the development of a unique method that enhances the functionality of material strips.

Latest Patents

Jens-Oliver Adam holds a patent for a "System and method for producing a strip of material with an integrated electronic component." This patent outlines a method that involves several steps, including feeding a material web, cutting pieces of material, and applying electronic components. The process ensures that the electronic component is securely integrated between two pieces of material, enhancing the overall utility of the strip.

Career Highlights

Adam is associated with Texmag GmbH Vertriebsgesellschaft, where he applies his expertise in material processing and electronic integration. His work at the company has allowed him to explore innovative solutions that bridge the gap between materials and electronics.

Conclusion

Jens-Oliver Adam's contributions to the field of electronic component integration demonstrate his commitment to innovation. His patent reflects a significant advancement in material processing technology, showcasing his role as a forward-thinking inventor.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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