Atlanta, GA, United States of America

Jenni Heerink

This inventor holds 1 USPTO granted patent. Top assignee: Koninklijke Philips Corporation N.v.. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jenni Heerink. Retrieved from https://idiyas.com/inventor/jenni-heerink

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 33(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Jenni Heerink: Innovator in Blister Pack Technology

Introduction

Jenni Heerink is a notable inventor based in Atlanta, GA (US). She has made significant contributions to the field of packaging technology, particularly with her innovative work on blister packs. Her dedication to improving product packaging has led to the development of a patent that enhances the functionality and usability of blister packs.

Latest Patents

Jenni Heerink holds a patent for a blister pack, which is designed to provide better protection and accessibility for its contents. This invention reflects her commitment to advancing packaging solutions that meet consumer needs.

Career Highlights

Heerink is currently employed at Koninklijke Philips Corporation N.V., where she continues to innovate and contribute to the company's mission of improving lives through meaningful innovation. Her work at Philips has allowed her to explore new ideas and technologies in the packaging sector.

Collaborations

Throughout her career, Jenni has collaborated with talented individuals such as Edward I Stamm, Jr. and Gregg Heard. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking solutions.

Conclusion

Jenni Heerink is a pioneering inventor whose work in blister pack technology exemplifies her innovative spirit and dedication to enhancing product packaging. Her contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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