Jeng-En Juang

Title: Innovations of Jeng-En Juang in Microelectroforming Technology.

Introduction

Jeng-En Juang is a notable inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of microelectroforming, particularly through his innovative patent that addresses challenges in mold fabrication. His work is recognized for enhancing the efficiency and durability of microelectroforming molds.

Latest Patents

Juang holds a patent titled "Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same." This invention discloses a method that utilizes a preformed metal substrate to avoid deformation of the microelectroforming mold caused by residual stress in the electroforming metal. The fabrication method includes several steps: forming a layer of bonding material on the preformed metal substrate, creating a high aspect ratio photoresist microstructure, filling the gaps with electroforming material, and using a thermal process to bond the components. This innovative approach shortens the electroforming time to one third of the prior art and increases the usability of the microelectroforming mold by more than three times.

Career Highlights

Jeng-En Juang is affiliated with the Industrial Technology Research Institute, where he continues to advance research in microelectroforming technologies. His work has not only contributed to academic knowledge but has also practical implications in various industries.

Collaborations

Juang has collaborated with notable colleagues, including Yuh-Wen Lee and Liang-Yu Yao, to further enhance the research and development of microelectroforming techniques.

Conclusion

Jeng-En Juang's innovative contributions to microelectroforming technology demonstrate his commitment to advancing the field. His patent reflects a significant improvement in mold fabrication processes, showcasing his role as a leading inventor in this area.