The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
Apr. 18, 2002
Yuh-wen Lee, Taoyuan Hsien, TW;
Liang-yu Yao, Taipei Hsien, TW;
Chao-chiun Liang, Taichung, TW;
Jeng-en Juang, Taipei Hsien, TW;
Ching-yi Wu, Hsinchu Hsien, TW;
Yuh-Wen Lee, Taoyuan Hsien, TW;
Liang-Yu Yao, Taipei Hsien, TW;
Chao-Chiun Liang, Taichung, TW;
Jeng-En Juang, Taipei Hsien, TW;
Ching-Yi Wu, Hsinchu Hsien, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
The invention discloses a microelectroforming mold using a preformed metal as the substrate and its fabrication method. Using a preformed metal as the substrate can avoid deformation of the microelectroforming mold due to residual stress in the electroforming metal. The fabrication method disclosed herein includes the steps of: forming a layer of bonding material on a surface of the preformed metal substrate after machining; forming a high aspect ratio photoresist microstructure on surfaces of the metal substrate and the bonding material; putting an electroforming material into the gaps of the photoresist microstructure to form an electroforming metal microstructure; and using a thermal process to bond the metal substrate and the metal micro structure by the bonding material and simultaneously bum off the photoresist microstructure to form a micro-electroforming mold. The invention shortens the electroforming time to be one third of the prior art, elongating the number of times the micro-electroforming mold can be used by a factor of more than three.