Hsinchu, Taiwan

Jen-Hao Hsieh

This inventor holds 1 USPTO granted patent. Top assignee: Tri Can Co., Ltd.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jen-Hao Hsieh. Retrieved from https://idiyas.com/inventor/jen-hao-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Jen-Hao Hsieh and Eco-Friendly Packaging Innovation.

Introduction

Jen-Hao Hsieh is an inventor based in Hsinchu, Taiwan. His patent work focuses on a manufacturing method for eco-friendly foam packaging material, and he is associated with Tri Can Co., Ltd.

Latest Patents

Hsieh’s listed patent, “Manufacturing Method of an Eco Friendly Foaming Package Material,” describes a process for producing compostable foam packaging. The method mixes raw materials, hybrid-melts them, forms the melt into plastic particles, and then melts and foams those particles through a non-chemical process. It combines biodegradable polymer with bio-cellulose and industrial starch, with decomposition enzymes used to alter the polymer’s properties. The patent record provided lists 1 patent for Hsieh.

Career Highlights

The patent highlights Hsieh’s work on a manufacturing approach intended to produce foam packaging with compostability in mind. His listed company affiliation is Tri Can Co., Ltd.

Collaborations

The provided information names Lucky Lee and Fong-Ru Yang as Hsieh’s coworkers. It does not specify their roles in the patent or describe particular collaborative contributions.

Conclusion

Jen-Hao Hsieh’s listed invention brings together biodegradable materials and non-chemical foaming in a process designed for compostable packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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