Company Filing History:
Years Active: 2016-2023
Title: The Innovations of Jen-Chang Liu
Introduction
Jen-Chang Liu is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of electronic devices, holding a total of 4 patents. His work focuses on enhancing the functionality and durability of touch modules and protective assemblies.
Latest Patents
One of his latest patents is a protective assembly that includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is made of transparent polymer and has a light transmittance greater than about 85%. It also features a thickness ranging from about 3 μm to about 15 μm, with a Poisson's ratio greater than about 0.4. The flexible substrate, which is disposed on the buffer layer, is doped with an inorganic compound and has a thickness ranging from about 3 μm to about 10 μm, along with a Young's coefficient ranging from about 1 GPa to about 10 GPa.
Another notable patent is for an electronic device that includes a cover plate, a touch sensing layer, and a display module. The cover plate consists of a glass layer and at least one transparent covering layer. The touch sensing layer is positioned under the cover plate, while the display module is located beneath the touch sensing layer.
Career Highlights
Throughout his career, Jen-Chang Liu has worked with several companies, including TPK Advanced Solutions Inc. and TPK Touch Solutions (Xiamen) Inc. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the electronics sector.
Collaborations
Jen-Chang Liu has collaborated with notable coworkers such as Tai-Shih Cheng and Lien-Hsin Lee. These partnerships have fostered a creative environment that has led to the development of cutting-edge technologies.
Conclusion
Jen-Chang Liu's contributions to the field of electronic devices and his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and inspire future innovations.