The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Dec. 14, 2021
Applicant:

Tpk Advanced Solutions Inc., Fujian, CN;

Inventors:

Jen-Chang Liu, Tainan, TW;

Xiang Mei Chen, Xiamen, CN;

Lian Jie Ji, Xiamen, CN;

Lien-Hsin Lee, Taipei, TW;

Tai-Shih Cheng, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0443 (2019.05); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/283 (2013.01); B32B 27/308 (2013.01); B32B 27/365 (2013.01); B32B 27/38 (2013.01); G06F 3/0446 (2019.05); B32B 2255/20 (2013.01); B32B 2307/412 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01); B32B 2457/208 (2013.01); G06F 2203/04111 (2013.01);
Abstract

A protective assembly includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 μm to about 15 μm, and a Poisson's ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from about 3 μm to about 10 μm and a Young's coefficient ranging from about 1 GPa to about 10 GPa.


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