Company Filing History:
Years Active: 1996
Title: **Jelco Klimaschewski: Innovator in Packaging Technology**
Introduction
Jelco Klimaschewski is a distinguished inventor based in Fellbach, Germany. He holds one patent that showcases his innovative contributions to the field of packaging technology. His work is a testament to the advancement of materials and functionality in packaging containers.
Latest Patents
Jelco's notable patent is for a laminate used in producing packaging containers. The invention describes a packaging container that incorporates a foil laminate with at least two layers featuring strategically placed openings. These two layers are bonded over their entire surface area except for a narrow channel. Within this channel, a valve strip is installed that operates in a valvelike manner to cover the openings of the inner layer. This design facilitates the escape of gas produced from overpressure in the packaging container, allowing for effective ventilation through the openings while the valve strip acts as an overpressure valve. The innovative arrangement of the valve strip and openings ensures a reliable escape of gas, significantly enhancing the usability of packaging containers.
Career Highlights
Jelco Klimaschewski is affiliated with Robert Bosch GmbH, a globally recognized company known for its pioneering efforts in engineering and technology. Throughout his career, Jelco has demonstrated a commitment to developing practical solutions that enhance packaging efficiency and functionality.
Collaborations
In his professional journey, Jelco worked alongside esteemed colleagues, including Klaus Domke and Herbert Stotkiewitz. Their collaboration plays a vital role in achieving innovative breakthroughs within their field, fostering a spirit of teamwork and shared expertise at Robert Bosch GmbH.
Conclusion
Jelco Klimaschewski's contributions to the packaging industry, particularly through his patented laminate design, highlight his significant role as an inventor. His innovative approach not only addresses the complexities of overpressure in packaging containers but also sets a foundation for future advancements in the field.