Company Filing History:
Years Active: 1989-1990
Title: Innovations by Jeffrey L. Popken
Introduction
Jeffrey L. Popken is a notable inventor based in Cincinnati, Ohio, recognized for his contributions to integrated circuit molding systems. With two patents to his name, he has made significant advancements in the field of electronics manufacturing.
Latest Patents
Jeffrey's latest patents include a "Lead frame assembly for an integrated circuit molding system" and a "New IC molding process." The lead frame assembly patent describes a design that interfaces with existing wire bonders using a single track system. This innovation allows for the efficient transfer of the bonded lead frame into the mold during the molding operation. The mold closes and clamps the lead frame, after which a compound charging system meters and injects a compound into the mold cavities. The process ensures that the bonding compound encapsulates the integrated circuit both above and below the lead frame. The new IC molding process patent similarly outlines a system that enhances the efficiency of the molding operation, utilizing a guide track system built into the mold chase.
Career Highlights
Jeffrey L. Popken is currently employed at Texas Instruments Corporation, where he continues to develop innovative solutions in the electronics sector. His work has contributed to the advancement of integrated circuit technology, making significant impacts on manufacturing processes.
Collaborations
Some of Jeffrey's coworkers include Jerry B. Medders and Susan S. Fitzgerald, who have collaborated with him on various projects within Texas Instruments Corporation.
Conclusion
Jeffrey L. Popken's contributions to integrated circuit molding systems demonstrate his commitment to innovation in the electronics industry. His patents reflect a deep understanding of manufacturing processes and a drive to improve efficiency in technology.