Company Filing History:
Years Active: 2005-2014
Title: Innovations by Jeffrey Dale Crowder
Introduction: Jeffrey Dale Crowder, an inventive mind from Phoenix, AZ, has made significant contributions to the field of semiconductor technology. With a total of three patents to his name, Crowder has demonstrated a passion for developing innovative solutions to enhance the performance and efficiency of semiconductor devices.
Latest Patents: Among his notable inventions, Crowder's latest patents include a Semiconductor device having a diamond substrate heat spreader. This patent describes a semiconductor device that incorporates a diamond substrate capable of efficiently dissipating heat from the semiconductor die via strategic bumps, thereby improving thermal management. Additionally, he is credited with a patent for a Method for manufacturing thin GaAs die with copper-back metal structures. This innovative approach allows a thin Gallium Arsenide (GaAs) substrate to be outfitted with a copper back-metal layer, facilitating compatibility with conventional packaging technologies and reducing heat dissipation issues.
Career Highlights: Crowder has built a distinguished career in the semiconductor industry, with experience at prominent companies such as Freescale Semiconductor and Estivation Properties LLC. His work has led to advancements that not only improve product performance but also offer significant cost savings for semiconductor packaging.
Collaborations: Throughout his career, Crowder has collaborated with fellow innovators including Alexander James Elliott and Monte Gene Miller. These partnerships have likely contributed to the development of his cutting-edge patents and innovations in semiconductor technology.
Conclusion: Jeffrey Dale Crowder is a compelling figure in the realm of semiconductor inventions. His patents showcase his creative thinking and commitment to resolving challenges within the industry. As technology continues to evolve, Crowder's contributions will undoubtedly play a significant role in shaping the future of semiconductor devices.