The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Feb. 02, 2009
Applicants:
Jeffrey Dale Crowder, Phoenix, AZ (US);
Dave Rice, Chandler, AZ (US);
Inventors:
Jeffrey Dale Crowder, Phoenix, AZ (US);
Dave Rice, Chandler, AZ (US);
Assignee:
Estivation Properties LLC, Dover, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/047 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/047 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/01079 (2013.01); H01L 23/3732 (2013.01);
Abstract
In accordance with one or more embodiments, a semiconductor device comprises a semiconductor die having a heat region disposed on at least one portion of the semiconductor die, and a diamond substrate disposed proximate to the semiconductor die, wherein the diamond substrate is capable of dissipating heat from the diamond substrate via at least one or more bumps coupling the diamond substrate to the heat region of the semiconductor die.