Company Filing History:
Years Active: 2002
Title: Jeffery Toh: Innovator in Semiconductor Packaging
Introduction
Jeffery Toh is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. He has developed innovative solutions that enhance the performance and reliability of electronic devices. His work is particularly significant in the context of modern technology, where efficient packaging is crucial for device functionality.
Latest Patents
Jeffery Toh holds a patent for a U-shape tape designed for BOC FBGA packages, aimed at improving moldability. This invention involves an FBGA packaged device that includes a die adhered to a substrate, with a small gap formed between them. An opening is created through the substrate adjacent to the center portion of the die. An encapsulating mold is formed around the die, extending into the gap and filling the channel. Additionally, at least one barrier is positioned in the gap between the substrate and the die, adjacent to the channel, to control the flow path of the encapsulating material during the mold formation process.
Career Highlights
Jeffery Toh is currently employed at Micron Technology Incorporated, where he applies his expertise in semiconductor technology. His role involves collaborating with a team of skilled professionals to drive innovation in packaging solutions. His contributions have been instrumental in advancing the company's technological capabilities.
Collaborations
Throughout his career, Jeffery has worked alongside talented colleagues, including Lim Thiam Chye and Lee Choon Kuan. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Jeffery Toh's innovative work in semiconductor packaging exemplifies the importance of creativity and technical expertise in the electronics industry. His patent for the U-shape tape demonstrates his commitment to improving device performance and reliability. His contributions continue to influence the field and inspire future innovations.