Jeff Reeder

Title: Jeff Reeder: Innovator in Semiconductor Packaging

Introduction

Jeff Reeder is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on innovative processes that enhance the efficiency and effectiveness of semiconductor packaging.

Latest Patents

One of Jeff Reeder's latest patents involves transfer mold semiconductor packaging processes. In this implementation, a circuit substrate is designed with opposing sides, where at least one side is configured for transfer mold packaging. This side features conductive traces and a soldermask that has multiple openings leading to the conductive traces. The soldermask also includes a peripheral elongated trench that aligns with a portion of an elongated mold void perimeter of a transfer mold, facilitating the transfer mold packaging process. This invention encompasses not only the packaging process but also the semiconductor package and a ball grid array.

Career Highlights

Jeff Reeder is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His role at Micron allows him to apply his innovative ideas and contribute to advancements in semiconductor technology.

Collaborations

Throughout his career, Jeff has collaborated with notable colleagues, including Larry Duane Kinsman and Richard W. Wensel. These collaborations have likely enriched his work and contributed to the development of his patents.

Conclusion

Jeff Reeder's contributions to semiconductor packaging through his innovative patents highlight his expertise and commitment to advancing technology in this field. His work at Micron Technology Incorporated continues to influence the industry positively.