This inventor holds 1 USPTO granted patent. Top assignee: Oc Oerlikon Balzers Ag. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: Jeff Ou-Yang: Innovator in Substrate Bonding Technology
Introduction
Jeff Ou-Yang is a notable inventor based in Beverly Hills, CA (US). He has made significant contributions to the field of substrate bonding technology. His innovative approach has led to the development of a unique method that enhances the efficiency and effectiveness of bonding disk-shaped substrates.
Latest Patents
Jeff Ou-Yang holds a patent for a method titled "Method for the bonding of disk-shaped substrates and apparatus for carrying out the method." This patent describes a process where a first substrate is positioned on a support surface within a vacuum chamber. The first bonding surface is spin-coated with adhesive, while a second substrate is held in place by suction. The method involves precise control of pressure and the use of support pins to ensure optimal bonding without non-bonded areas.
Career Highlights
Throughout his career, Jeff has demonstrated a commitment to innovation and excellence in his field. His work at Oerlikon Balzers AG has allowed him to explore advanced technologies and contribute to the development of cutting-edge solutions in substrate bonding.
Collaborations
Jeff has collaborated with Thomas Eisenhammer, working together to push the boundaries of substrate bonding technology. Their partnership has fostered an environment of creativity and innovation, leading to advancements in their respective fields.
Conclusion
Jeff Ou-Yang's contributions to substrate bonding technology exemplify the spirit of innovation. His patent and collaborative efforts highlight the importance of advancing technology for practical applications. His work continues to influence the industry and inspire future inventors.