This inventor holds 1 USPTO granted patent. Top assignee: Lockheed Martin Corporation. Active years: 2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011
Title: Jeff A. Bulow: Innovator in Electronic Module Technology
Introduction
Jeff A. Bulow is a notable inventor based in Syracuse, NY (US). He has made significant contributions to the field of electronic module technology. His innovative approach has led to the development of a unique device that addresses challenges in module installation and removal.
Latest Patents
Jeff A. Bulow holds a patent for a "Device for installing and removing high insertion force modules." This invention provides a solution for electronic module insertion and removal, particularly when high insertion and extraction forces are exerted in confined spaces. The device features a frame mounted to a cabinet housing the high insertion module. This frame includes a lever assembly that rotates about an axle attached to a hub. The hub can rotate to fixed angular positions, allowing the lever to move in proximity to the front surface of the high insertion module. By applying pressure to the lever, the module can be secured or unsecured from its cabinet, enhancing efficiency in module management. He has 1 patent to his name.
Career Highlights
Jeff A. Bulow is associated with Lockheed Martin Corporation, where he has contributed to various projects and innovations. His work has been instrumental in advancing technologies that improve the functionality and reliability of electronic systems.
Collaborations
Throughout his career, Jeff has collaborated with notable colleagues, including Stephen G. Race and Budd Shaw Honda. These partnerships have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.
Conclusion
Jeff A. Bulow is a distinguished inventor whose work in electronic module technology has made a significant impact. His innovative device for module installation and removal showcases his commitment to solving complex engineering challenges. His contributions continue to influence the field and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
