Poughkeepsie, NY, United States of America

Jed R Eastman

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1998-2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jed R Eastman. Retrieved from https://idiyas.com/inventor/jed-r-eastman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 44(Granted Patents)


Company Filing History:


Years Active: 1998-2000

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2 patents (USPTO):Explore Patents

Title: The Innovations of Jed R Eastman

Introduction

Jed R Eastman is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of multi-chip modules, holding a total of 2 patents. His work is primarily associated with the International Business Machines Corporation (IBM), where he has developed innovative solutions that enhance the functionality and accessibility of multi-chip modules.

Latest Patents

Jed R Eastman's latest patents include two groundbreaking inventions. The first is a "Multi-chip module with accessible test pads and test fixture." This invention features a test fixture designed for an improved multi-chip module, which includes a plurality of chips on the top surface. The module has at least one net associated with the chips that is completely embedded within the substrate. Additionally, it includes a pad attached to the bottom surface of the substrate, with a conductive path provided between the pad and the net. The test fixture incorporates a zero-insertion-force socket that has at least one socket pin for conductively contacting the pad on the multi-chip module.

The second patent is titled "Multi-chip module with accessible test pads." This improved multi-chip module also has a substrate with top and bottom surfaces, a plurality of chips on the top surface, and a plurality of pins on the bottom surface. Each chip has at least one lead extending through the substrate and is conductively coupled to a corresponding pin. The module features at least one net associated with the chips, completely embedded within the substrate, and includes at least one pad attached to the bottom surface of the substrate, with a conductive path coupled between the pad and the net.

Career Highlights

Throughout his career, Jed R Eastman has focused on advancing technology in the field of multi-chip modules. His work at IBM has positioned him as a key player in the development of innovative electronic solutions. His patents reflect his commitment to improving the efficiency and effectiveness of multi-chip modules, which are essential components in modern electronic devices.

Collaborations

Jed has collaborated with various professionals in his field, including his coworker Thomas J Bardsley. Their combined expertise has contributed to the successful development of advanced technologies at IBM.

Conclusion

Jed R Eastman is a distinguished inventor whose contributions to multi-chip module technology have made a significant impact in the electronics industry. His innovative patents and collaborative efforts continue to drive

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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